This process results in the formation of closely spaced fins with exceptionally smooth surfaces, maximizing the surface area available for heat dissipation. Heatsink skiving offers several advantages over traditional manufacturing methods, including greater design flexibility, improved thermal performance, and enhanced structural integrity. The resulting heatsinks are lightweight, compact, and capable of efficiently dissipating heat from electronic components, making them indispensable in applications ranging from computer processors and LED lighting to power electronics and automotive systems. With its ability to produce heatsinks with superior thermal properties and intricate designs, heatsink skiving represents a significant advancement in thermal management technology.
At Mitacor Industries, we are constantly trying to stay ahead of the curve by re-investing in new technologies and equipment. By doing so, we were able to learn new machining methods that were previously only available overseas. One of the new key processes we have added to our repertoire is Heatsink Skiving. With this process, we are able to turn around fast prototypes and even higher volume production built in-house in North America.
